Characteristics: Produced by specialized technique with premium grade MBD diamond raw materials, high strength, regular crystal shape, highly concentrated particle size distribution & effective particles, strictly control of rod-like and flaky shape particle, low impurity, high cutting efficiency of good sharpness, prominent dispersity and wear resistance.
Applications: Make diamond wire for dicing & slicing monocrystalline silicon, polycrystalline silicon, sapphire, LCD, magnetic materials, semiconductor materials, also used for other premium diamond grinding & polishing tools.
Available Coatings: Chemical Ni coating, Electroplated Ni coating, Ti-Ni
composite coating, customized coatings are also available.
(Nickel coating can greatly enhance the retention between
diamond particles and core wire. )